Wave Solder

Expertly machined from an existing pallet or from electronic PCB data, Presspahn has been manufacturing wave solder pallets from advanced materials for over 20 years. Our flexible and modern high speed CAD/CAM facility has the ability to turn any information supplied in to high quality wave solder pallets. This means that we can produce pallets to your specification to save you time and money, now and in to the future.

The type of material used in the wave solder process has to withstand very extreme conditions that is why only glass reinforced resin composites are used. These are normally produced from 8mm thick composite sheet being extremely tough, chemically resistant and E.S.D. safe.

Presspahn has successfully tested the new range of materials available for use with a lead-free solder process. These materials have been specifically designed to cope with the higher temperatures required of this process

Pallets can be machined in such a way as to leave "masked" areas on the underside which can preclude the need for masking tape and dots. They can also be supplied with a range of PCB fixing devices, the most common of which is the spring loaded Turnbuckle type although any custom design can be made.

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Thermal Insulation

Thermal Insulation is normally requested for two reasons; firstly when electrical insulation is required to work in high temperature ranges, secondly when there is need to prevent the loss of heat from a system


Electrical Insulation

Electrical insulation is chosen for its ability to resist the flow of electricity, nonconductive, it can be supplied in flexible thin films, thicker flexible laminates or rigid laminates and can be offered to suit various temperature ranges.