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WAVE SOLDER FIXTURES
 

Presspahn has successfully tested the new range of materials available for use with a lead-free solder process. These materials have been specifically designed to cope with the higher temperatures required of this process.

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Expertly machined from your PCB electronic data or existing pallet.

The flexibility and our modern high speed CAD/CAM facility has the ability to turn any information supplied in to high quality wave solder pallets. This means that we can produce pallets to your specification to save you time and money now and in to the future.

Our extensive knowledge of pallet manufacture, together with the most advanced composite materials ensures a first class produce every time.

The type of material used in the wave solder process has to withstand very extreme conditions that is why only glass reinforced resin composites are used. These are normally produced from 8mm thick composite sheet being extremely tough, chemically resistant and E.S.D. safe.

Pallets can be machined in such a way as to leave "masked" areas on the underside which can preclude the need for masking tape and dots. They can also be supplied with a range of PCB fixing devices, the most common of which is the spring loaded Turnbuckle type although any custom design can be made.

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Presspahn Ltd, Wharncliffe Works, Harrogate Road, Bradford, BD2 3TB
Tel: +44 (0) 1274 636333 Fax: +44 (0) 1274 626024
E:Mail:Sales@Presspahn.com